SMT PCB Assembly

Excellent Printed Circuit Board Assembly Capability:

1. Rigid PCBA; Rigid-flex PCBA

Eternity EMS specialize in Rigid and rigid-flex PCBA since 2005, and we focus on fields as communication electronics, financial device, industry control, automotive, new energy and medical equipment.

2. 0201 Chips; 0.4mm Pitch; μBGA/CSP

The size of 0201 component is 0.06mm*0.03mm*0.02mm(0,023" * 0.012" *0.08"), the mounting tolerance error is ±0.2μm.

0.4mm Pitch means the distance between 2 adjacent bonding pads is 0.4mm, some overseas customer think pitch means the distance between 2 adjacent components.

BGA is Ball Grid Array, is a type of surface-mount packaging used for integrated circuits, with advantages of high density, good heat conduction, and low lead inductance.

CSP is Chip Scale Package, also a type of integrated circuits package, According to IPC's standard J-STD-012, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package.

The features of CSP are small volume and light, more input and output terminals, good electrical, good thermal performance etc.

3. QFP/TSOP 0.4mm Pitch

A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. QFP is used more in large or very large scale integration circuit, with advantages of simple operation and high reliability, Parasitic parameter reduction. QFP is suitable for high frequency applications, which is mainly suitable for installing wiring on PCBS.

TSOP is Thin Small Outline Package, which not only has same advantages of QFP, but also cheap cost and high yield.

4. Potting & Conformal Coating

Both PCBA potting and conformal coating use organic polymers to protect PCBAs.

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5. 850mm x 500mm Board Size

Eternity EMS manufactures this size PCBA for Base Station to a Global Fortune 500 company.

6. Max 30 Layers Board

More layers, more expensive. A complex system for wiring requires PCB board with more layers. Supported by more layers PCBA, electronic wiring allows for more wiring space, so as to reduce electromagnetic interference and other various unstable factors effectively.

7. Press Fit

As an alternative to THT or SMT soldering, the press-fit technology helps to avoid thermal stress and ensures a high level of reliability of the connection and a high current carrying capacity.

8. Through-hole Assembly

Through-hole mounting techniques are used for bulkier or heavier components such as electrolytic capacitors or semiconductors in larger packages such as the TO-220 that require the additional mounting strength, or for components such as plug connectors or electromechanical relays that require great strength in support.

And Eternity EMS solders the components on the board by wave soldering machine after THT process.

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9. POP

Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them.

The PoP technology occurs to cater to electronics industry's constantly demands of fine pitch, smaller size, high signal processing speed and smaller mounting real estate towards electronic products such as smart phones and digital cameras. When applying this technology in the PCB assembly process, electric connection occurs between memory devices at upper package and logic devices at lower package, those devices can even be tested and replaced alone. All of these features help reduce PCB assembly costs and complexity.

10. Full range of PCBA tests:

• AOI

• ICT, MDA

• Functional test

• Environmental, Hi-Pot

11. Repair BGA Station

BGA rework stations, some customer called SMT and SMD rework stations, which play a critical role in PCB repair and modification. As their names imply, rework stations are spaces where technicians can alter surface-mounted devices and circuit boards with ball grid array (BGA) packaging. This is useful for several refinishing and repairing applications, including replacing missing components, removing defective components, reversing components that were installed incorrectly, and more.

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